Pang Sze Yong
Mobile technology isbeing upgraded continuously and new, user-friendly technologies are coming into the market. BE’s Anustup Roy Barman spoke with Pang Sze Yong, General Manager, Novoflex Pte. Ltd., about their new SIM card and its benefits and prospects.
Q. What is the new technology?
A. Our patented technology Secure Authenticable Identification Laminates changes the way SIM cards have been manufactured in the past. SIM cards are traditionally manufactured by assembling an IC chip into a smartcard module via a four step semiconductor assembly process which involves die attach, wire bonding, encapsulation and module testing. This is then followed by another eight steps in the card manufacturing process in order to lay the chip onto the printed plastic. In our new technology, the IC chip is directly attached onto a flexible substrate and this substrate is laminated onto the printed plastic. The technology brings down the overall cost of manufacturing by up to 40% based on material savings and reductions in processes from 12 to 6.
Q. How will it work?
A. This new SIM will function like any other traditional SIM card. Even the IC chip and operating systems within the chip can come from the current suppliers of SIM cards, so users will not experience any difference. In addition, as the process is compatible with existing card manufacturing machines and these new SIMs can be immediately integrated into current smartcard assembly processes.
Q. Will it fit in with the older mobile phones?
A. The new SIMs is available in 2FF, 3FF and 4FF formats and can be used with any mobile phones
that require a SIM card.
Q. How can this technology be helpful?
A. We see more and more devices other than mobile phones, tablets, and computers connected to the internet. The new technology is perfectly suited for the Internet of Things (IoT), allowing everyday objects to be connected, facilitating exchange of data and ushering in an era of convenience. As devices connect to a network, they will need to identify themselves. This is where the new technology comes in. The flexible nature of the substrate allows it to be laminated onto a wider variety of everyday devices for identification purposes and we see our new innovation as a great enabler of IoT.
Q. What are your plans of expansion?
A. While we are currently focused on developing and expanding the potential of our new product, we are also developing solutions to address other industries.
Q. How do you see the future of the Indian market?
A. We foresee that in the next few years, India’s demand for SIM cards will continue to be among the highest in the world due to a burgeoning middle class, more telecom companies incorporating this technology into their smart cards and 4G continuing its market penetration. The current consolidation in the tele-communications sector will stabilise and the remaining three or four major players will focus on other areas of growth like connected devices and 5G.